• - Equipment Name :Si DRIE System RIE-800iPB

• - Faculty :Faculty of Engineering and Applied Sciences

• - Department :Mechatronics and Robotics Engineering

• - Lab :

• - Manufacturer : samco https://www.samcointl.com/product/etching/si-drie/rie-800ipb/

• - Model: RIE-800iPB

• Special Features : High rate etching in MEMS mass production, High aspect ratio etching in mass production, Control of scalloping / Scallop-less non-bosch process, Excellent uniformity with tilt control, Bias pulsing for notch control at silicon on insulator (SOI) wafers, Extended process library. Etching Aspect ratio 1:80 for Si, etching rate more than 10um/min

high performance, inductively coupled plasma (ICP) etching system that uses high-density plasma to perform deep silicon etching required by MEMS and TSV applications. The RIE-800iPB is a dedicated silicon etching system specifically designed for the Bosch process (licensed from Robert Bosch GmbH). The systems� unique reaction chamber, electrode, stage and vacuum design overcomes the problems encountered in competing systems to allow High Rate (~50 ?m/min), Tilt Free, High Aspect Etching with industry leading selectivity (over 100:1).